Portada

INTEGRATED CIRCUIT PACKAGING, ASSEMBLY AND INTERCONNECTIONS IBD

SPRINGER
10 / 2010
9781441939234
Inglés

Sinopse

Electronic Manufacturing and the Integrated Circuit.- Integrated Circuit Manufacturing: A Technology Resource.- Packaging the IC-Single Chip Packaging.- The Chip Scale Package.- Multichip Packaging.- Known Good Die (KGD).- Packaging Options-Chip on Board.- Chip & Wire Assembly.- Tape Automated Bonding-TAB.- Flip Chip-The Bumping Processes.- Flip Chip Assembly.- HDI Substrate Manufacturing Technologies: Thin Film Technology.- HDI Substrate Manufacturing Technologies: Thick Film Technology.- HDI Substrate Manufacturing Technologies: Cofired Ceramic.- Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate.

PVP
170,63